Thin-film thermocouples (TFTC) have been extensively studied for their wide range of applications in various environments. However, TFTC faces challenges in electromagnetic environments as they can generate AC interference voltage. In this study, we introduce a thermocouple temperature sensor shielded by silver (Ag) thin film on both sides of aluminum oxide (Al
2
O
3
) substrate. The high conductivity of Ag film (11.48 mΩ/□) helps reduce interference caused by alternating current, resulting in a superior electromagnetic shielding effectiveness of 43.68 dB. The temperature sensitivity coefficient of this sensor is 20.87
$\mu$
V/°C at a hot end temperature of 318.44 °C. These shielded TFTC temperature sensors show great potential for applications in aerospace, iron and steel metallurgy, and other industries.
Hypersonic vehicles and aircraft engine blades face complex and harsh environments such as high heat flow density and high temperature, and they are generally narrow curved spaces, making it impossible to actually install them for testing. Thin-film heat flux sensors (HFSs) have the advantages of small size, fast response, and in-situ fabrication, but they are prone to reach thermal equilibrium and thus fail during testing. In our manuscript, an ITO–In 2 O 3 thick film heat flux sensor (HFS) is designed, and a high-temperature heat flux test system is built to simulate the working condition of a blade subjected to heat flow impact. The simulation and test results show that the test performance of the thick-film HFS is improved by optimizing the structure and parameters. Under the condition of no water cooling, the designed HFS can realize short-time heat flux monitoring at 1450 °C and long-term stable monitoring at 1300 °C and below. With a maximum output thermopotential of 17.8 mV and an average test sensitivity of 0.035 mV/(kW/m 2 ), the designed HFS has superior high-temperature resistance that cannot be achieved by other existing thin (thick) film HFSs. Therefore, the designed HFS has great potential for application in harsh environments such as aerospace, weaponry, and industrial metallurgy.
Inkjet printing presents a promising route for the scalable, high-resolution, and low-cost fabrication of functional oxide thin films; however, the design of robust inks capable of producing uniform, stable, and high-temperature-resistant oxide films remains highly challenging. Here, a highly stable precursor-based ink system for inkjet printing of ITO/In₂O₃ thin films is developed. By precisely tuning the mixed solvent ratio (EG:2-ME) and additive (EC) concentration, the rheological properties, jetting stability, and film uniformity are synergistically optimized, effectively suppressing the coffee-ring effect and improving surface morphology and structural density. The developed ink demonstrates good long-term storage stability and reproducibility, maintaining consistent chemical composition, particle size distribution, and thin-film performance over multiple batches and prolonged storage (120 days). Flexible thermoelectric films printed with this ink show reliable stability and repeatability of thermoelectric response over a broad temperature range (−196 to 848 °C), stable operation up to 100 h and under 50 thermal cycles at 800 °C. This work provides a reliable, scalable, and broadly applicable ink strategy for digital additive manufacturing of functional oxide films, contributing to the fabrication of flexible and devices for high-temperature sensing applications.
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