With the ongoing advancement of miniaturization and microfabrication, Micro-Electro-Mechanical Systems (MEMS) energetic devices are increasingly demanding higher output capabilities from energetic materials. This study investigates the incorporation of Titanium (Ti) into PVDF-based energetic films to improve their performance. We fabricated five Al/Ti/CuO/PVDF energetic composite films with varying Ti contents by direct ink writing (DIW). The results indicate that the Al/Ti/CuO/PVDF films demonstrate superior performance compared to Al/CuO/PVDF(AT-0). Notably, the 50 wt% Al/50 wt% Ti/CuO/PVDF (AT-50) film achieved optimal performance, exhibiting a 68% increase in combustion rate compared to the AT-0 film. Additionally, it showed a reduction in ignition delay time by 6 ms, an increase in flame temperature of 160.9 K, a 24% rise in maximum pressure, a pressurization rate enhancement of 117%, and an overall increase in heat release of 26.8%. This is attributed to the synergistic effect of the Al/Ti bimetallic fuels, where their close contact creates an alloying reaction that releases a large amount of heat and avoids the detrimental effects of Al sintering. This Al/Ti/CuO/PVDF energetic composite film, characterized by its exceptional synergistic mechanism and high energy output, holds significant promise for integration with MEMS devices, paving the way for innovative applications in micro-ignition, micro-propulsion, and micro-startup technologies. Highlights Ti was added to the PVDF-based energetic films to form the dual-fuel system. The Al/Ti dual-fuel has a synergistic effect to improve output performance. The 50wt%Al/50wt%Ti/CuO/PVDF film can achieve optimal output performance.
Jian Wang,Xinxing Zeng,Fude Nie,Renming Pan,Jie Chen,Yaofeng Mao,Haifu Wang,Xingquan Zhang,Jun Wang
Transient microchips have attracted considerable attention in the field of information security and privacy protection due to their self-destruction capability. Metastable intermolecular composites (MICs) are appealing for such applications due to their high energy density and rapid reaction kinetics, which meet the demands for miniaturization and fast response in transient microchips. However, weak interfacial interactions in conventional MICs limit the contact between components, hindering both microchip integration and ignition reliability. Herein, a hydrogen-bond assembly strategy is proposed to fabricate BC/GO/Al/CuO energetic films with exceptional flexibility and superior combustion performance. Dopamine modification introduces abundant hydroxyl groups onto the MIC particle surfaces, enabling the formation of a continuous hydrogen-bond network with binder bacterial cellulose (BC) binder and functional additive graphene oxide (GO).The integrated transient microchips retain structural integrity after 25 drop tests from 50 cm height, and the BC/GO/Al/CuO films are reliably ignited using a 3 V/3 A power supply, inducing complete destruction to the silicon substrate. This work demonstrates a novel strategy for creating highly flexible and reactive energetic films, showing great promise for application in advanced transient microchips.
危险品化学品经营许可证（带存储）