EUROPEAN POLYMER JOURNAL
·
2026
·
IF 6.8
LiLi Xia,Liyun Huang,Yanbin Wang,Zicheng Fan,Hyung Do Kim,Nan Zhou,Hideo Ohkita,Biaobing Wang
Polyimide (PI) aerogels have been widely used in desalination owing to their remarkable mechanical properties and thermal stability. However, their evaporation rates are poor. To improve this situation, a series of PI molecules bearing –CF 3 , –CH 3 , or –COOH pendant groups were synthesized to elucidate how molecular polarity affects interfacial water transport. The resulting PI films showed excellent tensile strength of beyond 100 MPa and high thermal decomposition temperature of beyond 250 °C. Among them, COOH-PI showed the strongest affinity for water: a water droplet completely infiltrated the corresponding aerogel within 4 s, whereas droplets remained on or were readily removed from the Me-PI and F-PI aerogels. And thus an evaporation rate of 3.23kg m -2 h −1 was achieved for carboxyl aerogel, which was far higher than methyl (0.58kg m -2 h −1 ) and trifluoromethyl (0.26kg m -2 h −1 ) aerogels. More encouragingly, the evaporate rate was nearly unaffected even it was suffered from 10 cyclic treatment. It is worthy to note that adsorption capacity of aerogel for both polar and nonpolar liquids was higher than 10 g g −1 and just slightly decreased after 20 cycles of testing. The compressive strength was up to 0.48 MPa, and this mechanical property was almost unaffected even they were exposed to heating (200 °C) or cooling (−20 °C) environment for 30 min. Overall, this work provided a meaningful insight for designing efficient aerogels for water evaporators.
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DIAMOND AND RELATED MATERIALS
·
2026
·
IF 5.2
Cong Wang,Zhiqing Wang,Jing Zhou,Jie Shen,Wen Chen
Filler-loaded thermally conductive composites offer a promising solution for thermal management in high-power electronic devices. Nonetheless, conventional physical blending strategies for BN/PI composites face a significant challenge: achieving uniform dispersion and high thermal conductivity simultaneously at low filler loadings is hindered by substantial interfacial thermal resistance. To overcome this challenge, we developed a covalent grafting strategy to construct a unique ‘branch-leaf’ biomimetic architecture through in-situ polymerization. Specifically, amino-functionalized boron nitride nanosheets (BNNS-NH 2 ) were prepared via 2,2′-bis(trifluoromethyl)benzidine-assisted ball milling of hBN. These nanosheets serve as ‘leaves’ grafted onto the polymer ‘branches’ through a dehydration condensation reaction between the amino groups and the carboxyl groups of polyamic acid. Experimental results demonstrate that the in-plane thermal conductivity of the polyimide composite film containing only 10 wt% BNNS-NH 2 is significantly enhanced to 5.43 W/(m·K), representing a 1911% increase compared to the pristine polyimide film. This composite film shows promise as a high-performance thermal interface material (TIM) and lateral heat spreader for high-power integrated circuits. Download: Download high-res image (152KB) Download: Download full-size image
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ACS Applied Materials & Interfaces
·
2026
·Vol. 18
·期 35
·48124-48134
·
IF 7.8
Lv Haoning,Yi Xing,Chen Kai,Yin Xia,Zhang Xinxin,Liu Yitao,Skorik Yury A.,Yu Jianyong,Ding Bin
With the increasing emission of particulate matter (PM) from industrial and transportation activities, the demand for filtration materials exhibiting high thermal and chemical stability is growing. Nanofiber materials have attracted significant attention owing to their small fiber diameter, high porosity, and large specific surface area, which enhance their initial filtration efficiency. However, their densely packed architectures and uniform pore distributions lead to rapid surface cake formation, increasing airflow resistance and limiting dust-holding capacity. In contrast, three-dimensional gradient aerogel structures incorporate multiscale pore channels that facilitate depth filtration. Such architectures provide greater dust storage capacity and delay pore blockage, thereby significantly improving overall filtration performance. Here, gradient nanofiber aerogels (MGPAs) with a microsphere structure were successfully fabricated based on a single-component polyimide system. Utilizing single-component materials enhances recyclability and ensures uniform thermal expansion under temperature fluctuations, which is crucial for high-temperature filtration applications. The prepared material exhibits a dual-layer gradient nanofiber aerogel structure, comprising coarse fibers (≈730 nm) and medium fibers (≈300 nm). Furthermore, a composite functional layer composed of microspheres (≈3.34 μm) and ultrafine fibers (≈60 nm) was deposited onto the medium-fiber layer surface. Benefiting from this hierarchical structure, the MGPAs exhibit a PM 0.3 filtration efficiency of 99.996%, with an initial pressure drop as low as 45.08 Pa, and a dust-holding capacity of 127 g/m 2 . Even at 300 ° C, it maintains a filtration efficiency of 99.91%. This demonstrates their excellent thermal stability. The developed MGPAs offer significant potential for high-temperature exhaust gas filtration applications.
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PubMed
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2025
·
IF 5.4
Long Cheng,Yongkang Zhang,Longlong Zhu,Hongmei Ge,Mingyu Wei
To overcome the limitations of conventional powder catalysts, such as recovery difficulty and aggregation, a three-dimensional polyimide-modified carbon nanotube/melamine sponge composite (PIC-MS) was fabricated via a freeze-drying process and applied for peroxymonosulfate (PMS) activation to degrade bisphenol A (BPA). Structural characterizations, including SEM, FT-IR, and XRD, confirmed the successful integration of polyimide-modified carbon nanotubes with the melamine sponge framework. By combining the high catalytic activity of polyimide-modified carbon nanotubes with the robustness and easy recoverability of the sponge structure, PIC-MS effectively addressed catalyst aggregation, deactivation, and separation challenges. The PIC-MS/PMS system achieved over 97 % BPA removal within 20 min and showed broad-spectrum degradation efficiency toward various organic pollutants. Moreover, the catalyst displayed excellent adaptability across a wide pH range (2.7–9.5) and preserved more than 87 % of its activity after six consecutive cycles, confirming strong stability and reusability. Mechanistic studies demonstrated that singlet oxygen ( 1 O 2 ) and superoxide radicals (O 2 •- ) were the dominant reactive oxygen species, with 1 O 2 playing the primary role. These species promoted sequential hydroxylation and oxidative ring-cleavage reactions, ultimately leading to complete mineralization of BPA into CO 2 and H 2 O. Quantitative structure-activity relationship (QSAR) analysis further indicated that the transformation products had much lower bioaccumulation factors than BPA, suggesting reduced environmental risk during degradation. This work highlights a sustainable strategy for constructing recyclable metal-free catalysts, offering promising prospects for advanced wastewater treatment.
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EUROPEAN POLYMER JOURNAL
·
2025
·
IF 6.3
Ke Yang,Haichao Meng,Hang Ye,Long Ni,Chen Qiu,Cuiqing Zhou,Yinfu Luo,Liwei Yan,Mei Liang,Huawei Zou
The development of polyimide (PI) resins with excellent heat resistance is of great significance in promoting equipment that meets the application requirements of harsh environments. Here, thermosetting PI resins with dual cross-linked networks were successfully fabricated using a vacuum hot press molding process. The dual cross-linked relied on hydrogen bonds derived from 3, 5-diaminobenzoic acid (DABA) and chemical bonds originated from acetylene in 4-phenylethynyl phthalic anhydride (4-PEPA) during heating. PI-3 (DABA: m-PDA = 2:2) possessed excellent heat resistance and mechanical properties, with a glass transition temperature (T g ) of 407°C, an initial thermal decomposition temperature of 535.6°C in N 2 , a compressive strength of 82.4 MPa, and a compressive modulus of 1107.8 MPa. Furthermore, PI-3 exhibited excellent resistance to thermal and oxidative aging, its compressive strength and compressive modulus remained at 76.4 MPa and 1213.0 MPa after being treated at 250 °C for 12 h. In all, the PI resins owned excellent mechanical strength and heat resistance, and were expected to be used as high-temperature-resistant structural material in fields such as aerospace and nuclear technology.
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INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH
·
2026
·
IF 3.9
Siyuan Zhang,Liang Chen,Yaping Zhang,Jinchao Li,Shuen Liang,Keping Chen,Ningning Song
Polyimide foams (PIFs) exhibit exceptional properties, including high-temperature resistance, radiation tolerance, and thermal insulation. However, they often face the inherent performance trade-off between mechanical toughness and heat resistance due to the much more rigid molecular frameworks, restricting their application in the field of high technology. To overcome this challenge, the strategy of regulating intermolecular free volume in this study was developed by introducing trifluoromethyl side groups into the polyimide backbone. The enlarged free volume with an enhancement of 8.62% for the fractional free volume (FFV) can promote the generation of abundant nucleation sites during the foaming process and result in a uniform and refined cellular architecture, which exhibits a decreased average pore size from 320 ± 100 to 200 ± 60 μm. Benefiting from the meticulously controlled porous structure, the optimal PIFs achieve a significant improvement of mechanical performance, with compressive strength, toughness, and modulus improving 180, 173, and 278%, respectively, which are superior to those of many other previously reported PI foams with similar or even higher densities. Specifically, the fatigue resistance of the PIFs was significantly enhanced, as evidenced by a compressive strength retention of 91.1% after 30 cyclic compression tests. Meanwhile, the PIFs also demonstrate remarkable heat resistance and thermal insulation, with the glass transition temperature increased by 22 °C and thermal conductivity ranging from 0.028 to 0.030 W·m–1·K–1 at room temperature. This strategy simultaneously improved the mechanical strength and toughness as well as heat resistance of PIFs, which is beneficial for its applications in extreme environments.
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MACROMOLECULAR CHEMISTRY AND PHYSICS
·
2020
·Vol. 221
·期 20
·2000256
·
IF 2.335
Shumei Liu,Qi Feng,Yang Li,Zhigeng Chen,Jianqing Zhao
A necklace-like supramolecular structure is constructed from 18-crown ether-6 (18CE6) as the host molecule and fluorinated polyimide (FPI) as the guest molecule to enhance the mechanical properties as well as to further lower the dielectric constant of FPI. The introduction of 18CE6 simultaneously enhances the stiffness and toughness of FPI films. In particular, the elongation at break is increased by over 200%. Furthermore, the dielectric constant of FPI films with 40 mol% 18CE6 is decreased to 2.74 from 3.15 of pure FPI, which is attributed to the enlarged free volume by the necklace-like supramolecular structure of 18CE6/FPI. Accordingly, the glass transition temperature of 18CE6/FPI films is slightly reduced to 305 °C, which is still high enough during the soldering process for the preparation of flexible copper clad laminate. In addition, the water absorption of FPI films is gradually decreased to 0.52% as the loading of 18CE6 raises to 40 mol%, representing the excellent moisture resistance of 18CE6/FPI films.
研究领域:
材料科学
·
化学工程
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IEEE Access
·
2026
·
IF 4.2
Xuanzhi Liu,Wenjie Liu,Yi Ding,Zeyi Wang,Chao Yin,Qingguo Chi
Polyimide (PI) is widely utilized in high-power electronic devices due to its outstanding thermal stability, superior mechanical strength, excellent electrical insulation, and chemical resistance. However, its intrinsically low thermal conductivity hinders its application in highly integrated systems. To address this limitation, the present study successfully prepared KH550-functionalized Boron Nitride Nanosheets (BNNs@KH550)/Polyimide composite films through a combined method of ball milling and silane coupling agent KH550 surface modification, aiming to develop advanced film materials that meet the stringent requirements of high-power electronics. XPS analysis confirmed the successful grafting of KH550 onto the BNNs surface, which significantly improved the dispersion uniformity of BNNs within the PI matrix and effectively suppressed agglomeration. In terms of performance, the KH550 modification demonstrated positive effects: contrasting with the continuous decline in breakdown strength caused by unmodified BNNs, the BNNs@KH550/PI film exhibited a slight enhancement in breakdown strength, reaching 543.3 kV/mm at a low filler loading of 2 wt%, and maintained the dielectric dissipation factor at an extremely low level, nearly identical to that of pure PI. Furthermore, the composite film’s thermal conductivity significantly increased with the BNNs@KH550 doping content, reaching 0.39 W/(m $\cdot $ K) at a 5 wt% loading. Regarding mechanical properties, the KH550 modification markedly enhanced the composite film’s tensile strength; at a 5 wt% loading, the film’s tensile strength (60.42 MPa) showed an 11.3% increase compared to the unmodified control group (54.27 MPa), strongly confirming that KH550 reinforces interfacial adhesion and promotes efficient stress transfer. This study provides a simple yet effective surface modification and fabrication strategy, offering support for the development of PI-based composite materials that possess excellent thermal management, electrical insulation, and mechanical properties.
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高影响因子
MACROMOLECULES
·
2015
·
IF 5.8
Yang Li,Jian Qing Zhao,Yan Chao Yuan,Chu Qi Shi,Shu Mei Liu,Shi Jing Yan,Ying Zhao,Ming Qiu Zhang
The strong interchain packing and polarity of polyimide (PI) compromise its outstanding thermal and mechanical properties. Crown ethers are theoretically expected to form host–guest inclusion complex with PI and improve its disadvantages. On the basis of this hypothesis, we synthesized a series of PI/crown ether composite films and investigated their synthesis mechanism, structures and properties. Our results suggest that the introduction of crown ethers increased the free volume of PI matrix and generated a special necklace-like supramolecular structure, which simultaneously and greatly improved PI’s mechanical, dielectric and hydrophobic properties. The Young modulus, elongation and tensile energy at break of PI composite films were maximally increased by 73.0%, 135.5%, and 190.0%, respectively. Meanwhile their dielectric constant and water absorption were minimized by 16.6% and 66.8%, respectively. Crown ethers with different molecular sizes demonstrated different improvement effects on PI’s properties. Their inclusion rates stabilized at ∼50%, which are related to the equal reaction probability between anhydride and amino groups.
研究领域:
材料科学
·
高分子化学
·
超分子化学
·
介电材料
·
纳米复合材料
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高影响因子
ACS Applied Polymer Materials
·
2022
·
IF 4.855
Jianwei Li,Jun Lin,Yugen Wang,Wei Chu,Fei Liu,Bin Wang
High-performance and light-weight polymer foams with ultralow dielectric constant, good thermal stability, and high mechanical strength are greatly needed in aviation and aerospace fields. In this work, cross-linked and rigid polyimide (PI) composite foams were fabricated based on norbornene terminated polyamide ester oligomer precursor powders via thermal foaming method. The obtained PI composite foams exhibit outstanding characteristics of light weight (90–130 kg·m–3) and high mechanical strength. When the glass fiber (GF) loading was 10 wt %, the compressive strength and modulus of PI/GF composite foams reached 1.7 and 49.6 MPa, respectively. Moreover, the PI foams exhibit remarkable thermal stability and fire-resistant property (LOI > 42%). The thermal conductivity of the prepared PI foams was measured to be in the range of 0.039–0.052 W·m–1·K–1 at room temperature. In addition, the PI composite foams present ultralow dielectric characteristic (tan δ = 0.006–0.008 at 10 GHz) and prominent wave-transparent performance (>95%) in the X band (8.2–12.4 GHz). These beneficial integrated properties enable the resultant PI composite foams to be attractive candidates for applications in aviation and aerospace fields.
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高影响因子
CERAMICS INTERNATIONAL
·
2022
·
IF 5.532
Song Zuo,Maohua Li,Shaoxiong Xie,Jinpeng Luo,Lexiang Xu,Yan Shi,Ningxiang Lan,Lang Zhou,Jinhong Yu,Xiaomin Li,Chuanqiang Yin
Boron nitride nanosheet (BNNS) is widely used in electronic thermal management due to its excellent planar thermal conductivity and insulating properties. However, it is challenging to improve the out-of-plane thermal conductivity of BNNS-doped composites due to the anisotropy of the thermal conductivity of BNNS. Therefore, the BNNS in the matrix must be oriented to obtain composites with high out-of-plane thermal conductivity. In this study, BNNS powders with directional structures were synthesized directly using sodium chloride templates. The as-obtained BNNS powders have a unique hollow cube-like structure with an ultra-low density of 2.67 × 10 −2 g/cm 3 and nearly 8 times the volume of the same mass of two-dimensional (2D) BNNS, making it easy to form the out-of-plane thermal conductivity paths in the polymer matrix . In addition, the high out-of-plane thermal conductivity of 4.93 W m −1 K −1 at 23.3 wt% loadings was obtained by doping it into a polyimide (PI) matrix. This value is 9.7 times higher than that of 2D BNNS-doped PI at the same loadings, 17.6 times higher than pure PI, and 6.1 times higher than the thermally conductive PI film sold by DuPont. Therefore, the prepared composite film has great potential for application in electronic thermal management.
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ACS Applied Nano Materials
·
2023
·
IF 5.9
Pengtu Zhang,Xiaoyun Liu,Peiyuan Zuo,Puke Mi,Qixin Zhuang
With the development of renewable energy resources, polymer-based dielectric materials, as key components in energy storage devices with optimized dielectric property, high-temperature stability, and good processibility, are highly demanded. In this study, p-phenylenediamine (PPD)-modified and l-ascorbic acid (LAA)-reduced graphene oxide (NH2-CRG) nanosheets with significant chemical functionalization and significantly improved dispersity were prepared. Also, polyimide was chosen to be the polymer matrix due to its high-temperature resistance, chemical inertness, and excellent mechanical property. By incorporating NH2-CRG into the PI polymer matrix via in situ polymerization, 0.8 wt % NH2-CRG/PI composite material with a dielectric constant as high as 839 and a breakdown strength of 80 kV·mm–1 was obtained. Meanwhile, the 5 wt % weight loss temperature of 0.8 wt % NH2-CRG/PI witnessed a 17.6 °C increase compared to pure PI. This work provided a promising strategy to prepare graphene-based materials for high-dielectric applications and a realizable process of fabricating polymer-based dielectric composite materials.
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高影响因子
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