FOOD CHEMISTRY
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2024
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IF 8.5
Luan Huang,Xin Zhou,Qingyun Chang,Shuaihua Zhang,Zhi Wang,Chun Wang,Xiaohuan Zang
Sulfonamide antibiotics have a broad spectrum of antibacterial action and are widely used, but their overuse poses a threat to human health. In this study, a three-dimensional conjugated microporous polymer, which was designated as TPM-CMP, was synthesized via Friedel-Crafts reaction by using tetraphenylmethane (TPM) and biphenyl dichlorobenzene as monomers, and it was utilized as an adsorbent in solid-phase extraction (SPE) of sulfonamides. The TPM-CMP demonstrated high extraction efficiency for sulfonamides due to π -stacking interactions, hydrophobic forces, and pore-filling effects. Consequently, the SPE was combined with liquid chromatography to detect sulfonamides in milk samples. For this method established in this study, a good linear response was observed in the range of 3.3–300.0 ng g −1 , with a detection limit ( S/N = 3) between 1.0 and 1.5 ng g −1 . The method recoveries of four sulfonamide in milk samples ranged from 83.4 % to 117 %, with relative standard deviations below 10 %.
研究领域:
分析化学
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环境科学
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DOI
PubMed
高影响因子
INDUSTRIAL CROPS AND PRODUCTS
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2026
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IF 6.4
Ting Jiao,Jian Jiao,Hongjie Zhang,Yun Cheng,Yuqian Guo,Qingwen Tian,Xuelian Zhou,Aixiang Pan,Yongjun Deng,Guigan Fang
The poor bleachability of eucalyptus chemi-mechanical pulp (CMP) is widely recognized as a major challenge in the industry. In order to overcome these challenges, a novel and eco-friendly Hydro-Brightening Pretreatment (HBP) strategy is proposed, with the objective of enhancing the brightness of eucalyptus through the removal of bioactive lumen extractives (LEs) using hot water. The majority compositions of LEs are characterised as ellagic acid, taxifolin and caffeic acid. The disruption of chromophore formation is evidenced by the removal of these LEs. During the bleaching reaction, ellagic acid is converted into quinonoid rings via elimination reactions, and taxifolin is oxidised to form trihydroxy benzoic acid and dicarboxylic acids, while caffeic acid undergoes esterification. In comparison with the LEs retained strategy, the implementation of HBP resulted in an enhancement of the brightness of 2.53% ISO for Eucalyptus grandis CMP, and reached a brightness of 80.85% ISO for Acacia crassicarpa Benth. CMP. Concurrently, the LEs of Eucalyptus grandis manifest notable antioxidative capacity (IC 50 =36.13 for DPPH radical). Consequently, this work provides a strategy that simultaneously enhances CMP bleachability and explores the possibility of extracting high-value antioxidant products from LEs, offering new insights on improving CMP bleachability and potential added-value co-products.
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DOI
高影响因子
ACS Omega
·
2024
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IF 3.7
Min Zhou,Liyuan Wei,Chongzhi Wu,Wei Chen,Zhengju Tang
Cytidine 5′-monophosphate (CMP) was widely applied in the food and pharmaceutical industries. Currently, CMP is mainly produced by enzyme catalysis. However, the starting materials for enzyme catalysis were relatively expensive. Therefore, seeking a low-cost production process for CMP was attractive. In this study, Escherichia coli (E. coli) was systematically modified to produce CMP. First, a the cytidine-producing strain was constructed by deleting cdd, rihA, rihB, and rihC. Second, the genes involved in the pyrimidine precursor competing pathway and negative regulation were deleted to increase cyti dine biosynthesis. Third, the deletion of the genes that caused the loss of CMP phosphatase activity led to the accumulation of CMP, and the overexpression of the rate-limiting step genes and feedback inhibition resistance genes greatly increased the yield of CMP. The yield of CMP was further increased to 1013.6 mg/L by blocking CMP phosphorylation. Ultimately, the yield of CMP reached 15.3 g/L in a 50 L bioreactor. Overall, the engineered E. coli with a high yield of CMP was successfully constructed and showed the potential for industrial production.
研究领域:
生物技术
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微生物学
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代谢工程
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DOI
PubMed
高影响因子
SEPARATION AND PURIFICATION TECHNOLOGY
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2026
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IF 9.1
Bin Hu,Jiani Liu,Xin Zhang,Lvming Qiu,Min Gong,Youmei Xing,Yunjian Yin,Weihua Fang,Zhen Wu,Guojie Wang
Silicon wafer cleaning, particularly the removal of nanoparticle contaminants after chemical mechanical polishing (CMP), is critical for advanced semiconductor manufacturing. Ceria (CeO 2 ) nanoparticles are among the most common abrasives in CMP, while their complete removal is challenging due to strong adhesion on the silicon wafer, therefore typically relying on aggressive solutions that may induce surface damage. To address this, the addition of surfactants has been adopted to resolve these challenges. Nonionic surfactants, in particular, have been widely studied due to their good environmental compatibility and low risk of ionic contamination. Herein, we report a class of trimeric nonionic surfactants TBTLn ( n = 4, 7, 11, and 16), comprising three hydrophobic tert-butyl groups, hydrophilic polyoxyethylene chains, and coordinating imine groups, which exhibit high surface activity and exceptional cleaning performance for CeO 2 nanoparticles. Systematic evaluation reveals that the trimeric architecture endows TBTLn with a remarkably low surface tension and superior wetting capability, significantly outperforming the corresponding monomeric and dimeric surfactants. Notably, TBTL16 with the longest polyoxyethylene chains achieves a perfect particle removal efficiency (PRE) of 100% on silicon substrates at a low concentration of 2 mM. The exceptional PRE is attributed to a synergistic mechanism where superior wetting, interfacial displacement, and coordination collectively act to reduce the adhesion of nanoparticles, enabling complete removal and preventing readsorption, as corroborated by experimental data and theoretical calculations. Collectively, this work presents a series of efficient trimeric surfactants for post-CMP cleaning, with great potential applications in advanced semiconductor manufacturing.
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DOI
高影响因子
CERAMICS INTERNATIONAL
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2026
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IF 6
Jiahui Ma,Jinchi Chen,Jie Cheng,Zhimin Chai,Yating Huang,Shirong Ge
Achieving a simultaneous enhancement of material removal efficiency and surface quality remains a central challenge in chemical mechanical polishing (CMP) of silicon dioxide. Conventional CeO 2 abrasives, despite their high chemical activity, are prone to agglomeration and cause detrimental scratches. To address this, a core-shell structured poly(methyl methacrylate)@CeO 2 (PMMA@CeO 2 ) composite abrasive was rationally designed and synthesized, in which flexible PMMA microspheres serve as the core and epitaxially grown CeO 2 nanocrystals form the active shell. By precisely controlling the Ce precursor concentration from 2 to 20 mmol, the CeO 2 loading can be systematically tuned from approximately 15 wt% to a saturation level of ∼31.5 wt%, demonstrating a well-bounded and highly controllable synthesis. Comprehensive characterizations confirm the uniform core-shell morphology, high crystallinity, and a consistent high relative Ce 3+ whose absolute number increases with the tunable CeO 2 loading. The optimized abrasive achieves a material removal rate of 102 nm/min and an ultra-low surface roughness of 0.112 nm on SiO 2 film, approaching atomic-level smoothness. Density functional theory calculations suggest that the work function difference between CeO 2 (111) and SiO 2 (001) drives directional electron transfer from CeO 2 to SiO 2 . This electron redistribution strengthens the topmost Si-O bond via chemisorption while imposing tensile stress that elongates and weakens the sub-surface Si-O bonds, potentially promoting preferential cleavage under mechanical shear. This atomic-scale insight, combined with the mechanical buffering effect of the PMMA core, establishes a unique synergy in which the CeO 2 shell provides high chemical activity for efficient material removal and the PMMA core suppresses scratching to ensure atomically smooth, low-damage finishing. This work provides a rational design paradigm for core-shell abrasives and a fundamental theoretical basis for next-generation high-performance CMP materials.
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高影响因子
BIOTECHNOLOGY & BIOTECHNOLOGICAL EQUIPMENT
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2022
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IF 1.762
Jingjing Wang,Jinyong Wu,Zhongkui Li,Xiangsong Chen,Weiwei Liu,Jianming Yao
Protein engineering is an effective method to improve the thermal stability of biological macromolecules. Cytidine monophosphate kinase (CMK) is a key enzyme involved in nucleotide metabolism and participates in the production of cytidine triphosphate. It has previously been confirmed that CMK shows low thermal stability. This study aimed to enhance the thermal stability of CMK. Herein, we first analyzed native CMK using PoPMuSiC. Thereafter, we constructed single point mutants (Q30G, P62R, E85I, D148W and K165L) and multipoint mutants of CMK with higher thermal stability using site-directed mutagenesis. The thermal stability of the mutant Q30G/E85I/K165L was observed to be 1.2-fold higher than that of the wild type. The mutants were then allowed to catalyse 3′-sialyllactose (3′-SL) synthesis. After 51.72 mmol/L N-acetylneuraminic acid (sialic acid) was consumed in a 25 mL reaction system and 50.67 mmol/L 3′-SL was obtained, a decrease of 2 h was recorded in the reaction time, whereas the yield rate increased by 33.6%. The results suggest that the mutant Q30G/E85I/K165L can improve the thermal stability of CMK and its catalytic efficiency for 3′-SL synthesis. These findings are crucial for various applications involving enzyme conversion.
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DOI
高影响因子
JOURNAL OF ALLOYS AND COMPOUNDS
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2018
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IF 3.779
Ailian Chen,Hailiang Mu,Changzhi Zuo,Yang Chen
Mesoporous silica (mSiO 2 ) particles are emerging as one of potential abrasives in high-efficiency and damage-free chemical mechanical planarization (CMP) due to their special mechanical and/or chemical characteristics. In this work, the dendritic meso-silica (D-mSiO 2 ) shells with tunable pore sizes were uniformly deposited on the solid silica (sSiO 2 ) core surfaces via a modified biphase stratification approach. As confirmed by FESEM, HRTEM , TEM , and N 2 adsorption-desorption measurements, the obtained spherical sSiO 2 /D-mSiO 2 composites with well-defined core/shell structures presented uniform diameter (ca. 340 nm), high surface area (∼210 m 2 /g), and large pore volume (∼0.3 cm 3 /g). The average pore size (3.6–11.6 nm) and shell thickness of D-mSiO 2 could be adjusted by varying hydrophobic solvents in the upper oil phases (1-octadecene, decahydronaphthalene, and n-hexane) and amount of silica source. Furthermore, the influence of the pore size of the sSiO 2 /D-mSiO 2 composites on oxide-CMP performance was investigated in terms of surface quality and material removal rate. In our experiments, the lowest average surface roughness was obtained for the composites with the largest pore size, which might result from their lowest overall hardness and elastic modulus determined by their largest porosity. In addition, the highest removal rate was achieved when the pore size of the composites was smallest. The enlarged surface area might contribute to enhancing the chemical corrosion, and further promoting the tribo-chemical reactivity between abrasive particles and substrate surfaces. Overall, the presented results are expected to provide experimental and theoretical basis for the structure optimization of mSiO 2 -based abrasive particles.
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产品关联
DOI
高影响因子
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
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2022
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IF 4.644
Nengyuan Zeng,Yuling Liu,Yuanshen Cheng,Chong Luo,Hongdong Zhao
The efficient copper removal of the in the multi-layer copper interconnect copper film chemical mechanical planarization (CMP) process is one of the important indicators for high production efficiency of integrated circuit process. The chemical corrosiveness of polishing slurries to copper is the key factor affecting the copper removal rate. Since the copper polishing slurries are relied too much on the synergistic effect of complexing agent and oxidant for the copper chemical dissolution to achieve efficient removal of copper film, the planarization and corrosion of copper CMP cannot be well improved. In this paper, it was found that adding potassium sulfate (K 2 SO 4 ) in polishing slurries can improve the copper removal effect of CMP. In this paper, the mechanism of the effect enhancement of K 2 SO 4 was explored with series of characterization experiments. Firstly, the influence of K 2 SO 4 on the increase of electrochemical corrosion degree of copper electrode was studied by electrochemical method. Secondly, based on X-ray photoelectron spectroscopy (XPS) and laser scanning confocal microscope (LSCM), it was determined that the copper surface oxide formation increased after electrochemical corrosion caused by K 2 SO 4 . Finally, the efficiency of copper polishing removal of K 2 SO 4 in polishing slurries was verified by CMP experiments, and the dynamic oxidation enhancement mechanism of K 2 SO 4 in polishing slurries for CMP copper removal was analyzed.
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DOI
高影响因子
JOURNAL OF FOOD PROTECTION
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2020
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IF 1.581
Hongying Li,Qiujin Zhu,Rui Chang,Ke Hu,Xuling Zhu,Aqi Xu,Shitao Xu,Pengyu Tang
ABSTRACT In order to reduce the health risks associated with red meat as listed by the World Health Organization, the work presented in this article aimed to elucidate the interaction between 5′-CMP–supplemented feed and N -glycolylneuraminic acid (Neu5Gc) in experimental animals in vivo. 5′-CMP was added to the diet of 90-, 180-, and 270-day-old Xiang pigs, and after 30 days, the Neu5Gc contents, physicochemical parameters, and free amino acid contents of muscle and internal viscera were measured by high-performance liquid chromatography coupled with fluorescence detection. The mechanism by which 5′-CMP affects Neu5Gc contents was investigated using molecular docking. Results show that 5′-CMP significantly decreased the Neu5Gc content in 180-day-old Xiang pigs ( P < 0.05) but had no effect on the Neu5Gc contents in 90- and 270-day-old Xiang pigs. Umami amino acids were significantly increased in 180-day-old Xiang pigs. In the 90- and 270-day-old pigs, histidine increased by 10.38 and 17.87%, respectively. The other free amino acids were either reduced or not affected. Moreover, the 5′-CMP–supplemented diet did not affect the physicochemical parameters of the longissimus muscle in the Xiang pigs. 5′-CMP could occupy almost all the sialyltransferase active-site residues but not His302 and showed inhibition of the sialyltransferase activity. The results provided an experimental basis for the subsequent reduction of Neu5Gc in red meat before slaughter.
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DOI
PubMed
高影响因子
APPLIED SURFACE SCIENCE
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2017
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IF 3.387
Guang Yang,Peng He,Xin-Ping Qu
The inhibitory effect of glycine on corrosion and chemical mechanical polishing (CMP) of Mo in hydrogen peroxide (H 2 O 2 ) based abrasive-free alkaline slurry has been investigated. Results show that, in H 2 O 2 based slurry, both static etching rate (SER) and removal rate (RR) of Mo during chemical mechanical polishing were reduced by adding glycine and the inhibition efficiency was around 50%. From ex-situ and in-situ open circuit potential (OCP), current density transient and potentiodynamic polarization measurements, it is found that formation of oxides was delayed due to blocked contact between oxidizer and the sample surface by electrostatic adsorption of glycine zwitterion on the surface. Glycine can form complex with MoO 3 and promote dissolution of surface oxide, MoO 3 , resulting in a reduced passivation layer. The slowed oxidation reaction dominates the whole process, resulting inhibited Mo corrosion and leading to a smoother Mo surface.
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产品关联
DOI
高影响因子
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
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2025
·
IF 4.6
Yongkang Guo,Yanchao Ge,Shenao Nie,Yuxuan Qiu,Xin Wang,Yangang He
Polysilicon (Poly-Si) is crucial for gate electrodes and interconnects in integrated circuits. Surface uniformity after Chemical Mechanical Polishing (CMP) critically impacts device performance, especially with stringent photolithography requirements at scaled dimensions. Optimizing slurry formulation enhances uniformity, but the synergy between polymer (e.g., Polyvinyl Alcohol, PVA) and nonionic surfactant (e.g., Fatty Methyl Ester Ethoxylates, FMEE) and its effect on Poly-Si CMP uniformity remain unclear. This study introduced PVA and FMEE into an alkaline slurry. Post-CMP uniformity (Site Front Quotient Range, SFQR; Within-wafer Nonuniformity, WIWNU) and roughness (Local Root Mean Square Roughness, Sq) were evaluated using wafer geometry testing and Atomic Force Microscopy (AFM). Adsorption behavior and polishing effects were investigated via X-ray Photoelectron Spectroscopy (XPS), Attenuated Total Reflection Fourier Transform Infrared spectroscopy (ATR-FTIR), Molecular Dynamics (MD) simulation, and friction testing. Compared to control (Blank), PVA/FMEE slurry significantly improved uniformity: SFQR reduced by 0.05 μm, edge WIWNU decreased to 2.97 %, and Sq optimized to 0.55 nm. PVA and FMEE synergistically form a dense composite adsorption layer via hydrogen bonding, selectively modulating local removal rates through lubrication and interfacial protection. Synergizing with enhanced abrasive dispersion stability, this mechanism improves Poly-Si CMP surface uniformity. The findings provide insights for developing high-precision Poly-Si CMP slurries.
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高影响因子
JOURNAL OF MOLECULAR LIQUIDS
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2024
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IF 5.3
Qinhua Miao,Lei Fan,Fan Zhang,Yaran Lv,Jie Cheng
Cobalt is a potential substitute for copper as local interconnects in sub-10 nm interconnects, the chemical mechanical polishing (CMP) of which is quite challenging due to the high chemical reactivity of Co. By using a combination of experiments and theoretical calculations, the optimum corrosion inhibitor of Co is identified and the corrosion inhibition mechanism of TTLYK on Co is further investigated. It investigates the effects of various corrosion inhibitors, including potassium oleate, dodecyl benzene sulphonic acid, octyl hydroxamic acid, and 2,2′-[[(methyl-1H-benzotriazol-1yl) methyl] imino] bis-ethanol (TTLYK) on Co through chemical mechanical polishing and static etching experiments. The results show that among various corrosion inhibitors, TTLYK presents the best corrosion inhibition effect. When the basic slurry contains 10 mM TTLYK, the corrosion inhibition efficiency could reach 96.23 %, the material removal rates of Co is 161.79 nm/min, the static etching rates is 0.85 nm/min, and the material removal selectivity ratio of Co and Ti is 39:1. The results fully meet the requirements of the Co bulk CMP process. It is revealed TTLYK could form a protective layer with a synergistic physical and chemical adsorption on Co, in which the chemical adsorption occurs through the formation of Co N bonds. The adsorption of TTLYK could decelerate the transformation of CoO and Co(OH) 2 to Co 3 O 4 , and the as formed Co-TTLYK complex provides the main corrosion inhibition.
研究领域:
材料科学
·
表面工程
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DOI
高影响因子
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