D2614080计算溶液所需的质量、体积或浓度。
Ala-1511198半导体清洁剂
有货
为什么选择此级别
半导体级 ，适用于对基线干扰要求严格的色谱和分析工作流程。
储存与运输
室温。常规运输 。请查阅批次 COA 获取详细规格。
质量文档
SDS、COA、产品数据表及规格说明书均可下载。可通过批号查询获取批次 COA。
文献证明
在色谱分析、有机合成和交叉偶联反应领域已被 13373 篇同行评审文献引用。
概述
1. 脱水干燥
半导体清洗后晶圆 / 部件表面易残留微米级水膜，直接干燥会形成水痕、离子残留，本品因与水无限互溶、表面张力低、挥发速率快，能快速置换水膜并随水分一同挥发，实现无痕迹干燥。
适用制程：晶圆湿法清洗（RCA 清洗）后脱水、光刻显影后干燥、封装基板清洗后脱水、光学掩膜版清洗干燥
使用方式：浸泡置换、喷淋冲洗、气相蒸汽脱水
2. 去除轻量有机污染物
本品对非极性 / 弱极性有机污染物（如油污、指纹、光刻胶稀释剂残留、少量聚合物残渣）有良好溶解性，且对半导体基础材料无腐蚀，适合轻度有机污染的预清洗 / 后清洗。
适用制程：晶圆来料表面清洁、设备夹具 / 管路日常清洗、封装引线框架除油、光刻胶涂覆前晶圆预处理
优势：对比丙酮、NMP 等强有机溶剂，乙醇毒性更低、环保性更好，无闪点（无水乙醇闪点 12℃，操作时控温即可），适配产线安全要求。
3. 清洗剂复配助剂（氟醚 / 水基清洗剂核心配套）
这是本品在先进制程精密清洗中的关键用途，单独使用时对强极性污染物溶解力有限，因此常作为氢氟醚（HFE）、水基清洗剂的复配组分，弥补单一清洗剂的短板：
与 HFE 复配（如 C4FE/C5ME）：提升氟醚对极性有机盐、水溶性残留的清洗能力，同时降低氟醚表面张力，增强对微纳结构（TSV 通孔、FinFET）的渗透力，清洗后产品与氟醚一同挥发，无二次残留；
与水基清洗剂复配：作为助溶剂，提升水基清洗剂对有机污染物的溶解性，同时起到消泡、快速干燥的作用，适配晶圆湿法清洗后的中和清洗。
4. 稀释剂与润湿性调节剂
稀释半导体用光刻胶、显影液、剥离液，精准调节浓度，保证涂覆 / 显影的均匀性；
加入其他清洗剂中调节润湿性，避免清洗液在晶圆表面形成液珠，防止液珠干燥后产生局部残留，提升清洗均匀性。
1、Dehydration and Drying
Micron-scale water films tend to remain on the surface of wafers/components after semiconductor cleaning, and direct drying will cause water marks and ionic residues. This product is infinitely miscible with water, featuring low surface tension and a fast volatilization rate. It can quickly displace water films and volatilize together with water to achieve mark-free drying.
Applicable Processes: Dehydration after wafer wet cleaning (RCA cleaning), drying after photolithography development, dehydration after package substrate cleaning, cleaning and drying of optical photomasks
Usage Methods: Immersion displacement, spray rinsing, vapor phase dehydration
2、Removal of Light Organic Contaminants
This product has good solubility for non-polar/weakly polar organic contaminants (e.g., oil stains, fingerprints, residual photoresist thinner, a small amount of polymer residue), and is non-corrosive to basic semiconductor materials, making it suitable for pre-cleaning/post-cleaning of light organic contamination.
Applicable Processes: Surface cleaning of incoming wafers, daily cleaning of equipment jigs/pipelines, oil removal of package lead frames, wafer pre-treatment before photoresist coating
Advantages: Compared with strong organic solvents such as acetone and NMP, ethanol has lower toxicity and better environmental performance. With a flash point of 12℃ for anhydrous ethanol (temperature control is only required during operation), it meets the safety requirements of production lines.
3、Blending Additive for Cleaning Agents (Core Matching for Fluoroether/Water-based Cleaning Agents)
This is a key application of the product in precision cleaning for advanced processes. Its solubility for strong polar contaminants is limited when used alone, so it is often used as a blending component for hydrofluoroether (HFE) and water-based cleaning agents to make up for the shortcomings of single cleaning agents:
Blending with HFE (e.g., C4FE/C5ME): Improves the cleaning ability of fluoroethers for polar organic salts and water-soluble residues, while reducing the surface tension of fluoroethers and enhancing the penetration into micro-nano structures (TSV vias, FinFET). After cleaning, the product volatilizes together with fluoroethers without secondary residues.
Blending with water-based cleaning agents: Acts as a cosolvent to improve the solubility of water-based cleaning agents for organic contaminants, and also functions as a defoamer and for rapid drying, suitable for neutralization cleaning after wafer wet cleaning.
4、Thinner and Wettability Regulator
Dilutes photoresists, developers and strippers for semiconductor use to precisely adjust concentrations and ensure the uniformity of coating/development.
Added to other cleaning agents to adjust wettability, prevent the formation of liquid beads of cleaning solution on the wafer surface, avoid local residues after liquid bead drying, and improve cleaning uniformity.
规格
别名
乙醇 | 酒精
英文别名
Ethyl alcohol
规格或纯度
半导体级, Total metal impurities ≤ 2ppm，Particles ≥ 0.5 μm: ≤ 25 per mL
英文名称
Ala-1511198 Semiconductor cleaning agent
储存条件
室温
运输条件
常规运输
名称和识别符
EC号
200-578-6
分子类型
小分子
Isomeric SMILES
CCO
UN Number
Packing Group
II
分子量
46.07
Beilstein号
1718733
技术文档
高级数据
化学和物理性质
敏感性
易吸湿
折光率
1.3600 (lit.)
闪点(℃)
13°C
沸点
78.15°C
熔点
-114.1°C
安全和危险性（GHS）
一般危化品
一般危化品
信号词
危险
危险声明
H225: 高度易燃的液体和蒸气
H319: 引起严重眼睛刺激
预防措施声明
P210: 远离热源，热表面，火花，明火和其他点火源。 - 禁止抽烟。
P233: 保持容器密闭。
P240: 地面/粘结容器和接收设备
P241: 使用防爆的[电气/通风/照明/.../]设备。
P242: 仅使用无火花的工具。
P243: 采取防静电措施
P264: 处理后要彻底洗手。
P280: 戴防护手套/穿防护服/戴防护眼罩/戴防护面具。
P303+P361+P353: 如皮肤（或头发）沾染：立即脱掉所有沾染的衣服。用水清洗皮肤/淋浴。
P305+P351+P338: 如进入眼睛：用水小心冲洗几分钟。如戴隐形眼镜并可方便地取出，取出隐形眼镜。继续冲洗。
P337+P313: 如仍觉眼刺激：求医/就诊。
P370+P378: 火灾时：使用干砂、干粉或抗醇泡沫灭火。
P403+P235: 存放在通风良好的地方。保持低温。
P501: 将内容物/容器处理到。。。
WGK Germany
1
Class
3
个人防护装备
Eyeshields, Faceshields, full-face respirator (US), Gloves, multi-purpose combination respirator cartridge (US), type ABEK (EN14387) respirator filter
质检证书（CoA,COO,BSE/TSE 和分析图谱)
技术文档和文章
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目录： 技术文章
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目录： 技术文章
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目录： 技术文章
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目录： 技术文章
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目录： 技术文章
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目录： 技术文章
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目录： 技术文章
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目录： 技术文章
此产品的引用文献
溶液计算器
常见问题
什么是「半导体级」？
「半导体级」表示该物料经过加工和检测，适用于半导体和电子制造。规格侧重于影响该应用性能的杂质——例如，电子应用的金属含量、电池应用的粒度、光学应用的折射率，或对水分敏感工艺的水分含量。
本产品应如何储存？
请于室温条件下保存。
本产品如何运输？
本产品按常温标准条件运输，无需温控包装。
本产品的 CAS 号、分子式和分子量是多少？
本产品的 CAS 号为 64-17-5，分子式为 C2H6O，分子量为 46.07 g/mol。
如何获取批次专用COA？
每个订单都会随附分析证书（COA），您也可以从账户订单历史中下载。如需订购前的COA，请联系您的客户代表，或使用PDP上的"申请COA"按钮——我们将提供代表性批次的COA。
产品仅提供给经过验证的企业、机构和合格的专业人员用于研发。不适用于人类、动物、诊断或治疗。
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